EE 426
Semiconductor Devices
Table of Contents
Specific Course Topics
Topics include : Overview of microelectronics fabrication processes; photolithography techniques; oxidation theory, processing and characterization; diffusion theory, processing, and characterization; film deposition techniques, interconnections and contacts in integrated circuits; microelectronic packaging options; and MOS device process integration. The laboratory portion of the course will focus on clean room protocol, and the use of semiconductor processing equipment in the fabrication and characterization of resistors, diodes, and transistors on silicon wafers.
Class/laboratory Schedule:
(2) 50 minute lectures and (1) two-hour laboratory each week
Prerequisite:
EE 355 - Electronics I
Textbook:
Jaeger, "Introduction to Microelectronic Fabrication, Volume V of Modular Series on Solid State Devices," 2nd ed.
Course Objectives1:
1. Develop an understanding of semiconductor device theory and
fabrication [A,B,C,E]
2. Develop the skills necessary to design, fabricate, and characterize basic
semiconductor devices in the laboratory [A,B,C,D,E]
3. Develop a familiarity with recent developments in semiconductor
devices [A,B,E]
1
Letters in brackets correspond to Electrical Engineering program objectivesIntroduction
Overview of Microelectronic Fabrication
Historical Trends
Processes and Structures
Resistor, Diode, and Transistor Layout Design
Safety Issues
Thermal Oxidation of Silicon
Oxidation Theory and Modeling
Oxidation as Barrier Layer
Oxide Types and Quality
Oxide Thickness Characterization
Lithography
Photolithography Process Flow
Wafers
Barrier Layer
Photoresist Types, Application, and Processing
Etching and Pattern Definition
Photomask Fabrication
Exposure Systems
Microscopy
Diffusion
Diffusion Theory and Modeling
Junction Formation
Sheet Resistance Theory and Measurement
Diffusion Systems
Film Deposition
Evaporation
Sputtering
Chemical Vapor Deposition
Epitaxy
Interconnections and Contacts
Ohmic Contact Formation
Packaging and Yield
Device Characterization
Die Attachment
Wire Bonding
Package Styles
Flip Chip, BGA, TAB
CSP
Yield
"Recent Developments in Semiconductor Devices" paper
presentations
for Objective 1:
a. Students will demonstrate an
understanding of semiconductor device fabrication history, trends, and
terminology.
b. Students will demonstrate an
understanding of the process flow associated with semiconductor device
development.
c. Students will demonstrate an
understanding of the concepts of photolithography, oxidation, diffusion,
deposition, and semiconductor device characterization.
for Objective 2:
a. Students will demonstrate an
ability to perform photolithography, including mask design, image transfer, and
chemical processing.
b. Students will demonstrate an
ability to perform oxidation.
c. Students will demonstrate an
ability to perform dopant diffusion.
d. Students will demonstrate an
ability to perform metal deposition.
e. Students will demonstrate an
ability to characterize semiconductor devices at various stages in their
fabrication.
for Objective 3:
a. Students will demonstrate an ability to
research recent developments in semiconductor devices.
b. Students will demonstrate an ability to
prepare a formal written report on a recent development in semiconductor
devices.
c. Students will demonstrate an ability to
prepare a formal oral presentation on a recent development in semiconductor
devices.
Contact Information:
Office : 507 Nichols Hall
Phone : 464-7343 (office)
464-3961 (home)
E-Mail : addingtonjs@vmi.edu
Office Hours:
Monday, Tuesday, Thursday : 0900-1100, 1300-1400
Friday : 1000-1100, 1300-1400
(and by appointment)
Lecture Policies:
Homework - Usually assigned once a week
Midterm - During regular class time
Paper/Presentation - Topic: "Recent Developments in Semiconductor
Devices"
Final - Comprehensive
No make-up tests will be given.
Late homework will be graded accordingly.
|
Lecture Grading Policy |
Laboratory Grading Policy |
| Homework = 25% | Lab Progress Reports = 40% |
| Midterm = 25% | Lab Final Report = 60% |
| Paper/Presentation = 20% | |
| Final = 30% | |
| Lecture Grade = 100% | Laboratory Grade = 100% |
|
Overall Course Grade |
| Lecture Grade = 2/3 |
| Laboratory Grade = 1/3 |
| Overall Grade = 3/3 |
(1) "Cadets' Responsibilities"
"Work for grade" is defined as any
work presented to an instructor for a formal grade or undertaken
in satisfaction of a requirement for successful completion of a course or degree
requirement. All work submitted for grade is considered the cadet's own
work. "Cadet's own work"
means that he or she has composed the work from his or her general accumulation
of knowledge and skill except as clearly and fully documented and that it has
been composed especially for the current assignment. No work previously submitted in any course at VMI or
elsewhere will be resubmitted or reformatted for submission in a current course
without the specific approval of the instructor.
In all work for grade, failure to distinguish between the cadet’s own work and
ideas and the work and ideas of others is known as plagiarism.
Proper documentation clearly and fully identifies the sources of all
borrowed ideas, quotations, or other assistance. The
cadet is referred to the VMI-authorized handbook for rules concerning
quotations, paraphrases, and documentation.
In all written work for grade, the cadet must include the words "HELP
RECEIVED" conspicuously on the document, and he or she must then do one
of two things: (1) state
“none,” meaning that no help was received except as documented in the work;
or (2) explain in detail the nature of the help received.
In oral work for grade, the cadet must make the same declaration before
beginning the presentation. Admission
of help received may result in a lower grade but will not result in prosecution
for an honor violation.
Each cadet bears the responsibility for familiarizing himself or herself
thoroughly with the policies stated in this section, with any supplementary
statement regarding work for grade expressed by the academic department in which
he or she is taking a course, and with any special conditions provided in
writing by the professor for a given assignment.
If there is any doubt or uncertainty about the correct interpretation of
a policy, the cadet should consult the instructor of the course.
There
should be no confusion, however, on the basic principle that it is never
acceptable to submit someone else’s work, written or otherwise, formally
graded or not, as one’s own.
The violation by a cadet of any of these
policies will, if he or she is found guilty by the Honor Court, result in his or
her being dismissed from VMI. Neither
ignorance nor professed confusion about the correct interpretation of these
policies is an excuse.
(3)
Faculty Policies
(a)
Peer Collaboration:
Peer collaboration is not permitted for this course.
All homeworks and the paper/presentation are certified as your own, independent work.
You may not receive assistance from any sources other than your
instructor and any sources authorized by your instructor.
You may discuss general course concepts with each other; however, you may
not discuss specific assigned problems.
All lab work is certified as the work of the lab group only.
You may not receive assistance from any sources other than your
instructor and any sources authorized by your instructor.
You may discuss general lab concepts and procedures with each other;
however, you may not share lab data.
All tests and exams are certified as your own, independent work.
(b)
References:
Students must properly reference
direct quotations (with quotation marks and source), as well as significant paraphrasing
(with source).
Unless a direct quotation is
necessary, put the information in your own words to demonstrate your understanding of the
material.
See "Easy Access" for
more information regarding quotations and proper paraphrasing.
(c)
Other:
Paper topic must be approved by the instructor.
| January 21 | No Lab |
| January 24 | No Lab |
| January 28 | Introduction (Overview, Safety) |
| February 4 | Wet Oxidation |
| February 11 | Oxide Thickness Measurement |
| February 18 | Photolithography (Mask 1) (Progress Report #1 Due) |
| February 25 | Diffusion |
| March 3 | Photolithography (Mask 2) (Progress Report #2 Due) |
| March 10 | Dry Oxidation |
| April 7 | Oxide Thickness Measurement |
| April 14 | Photolithography (Mask 3) (Progress Report #3 Due) |
| April 21 | Aluminum Deposition and Photolithography (Mask 4) |
| April 28 | Device Characterization (Progress Report #4 Due) |
| April 30 | Device Characterization |
Homework #1 Paper/Presentation
History of the transistor (PBS)
Wafer Fabrication Presentation
Light-emitting transistor operating at 509 GHz (University of Illinois)
Semiconductor Acronym Lists:
http://www.smta.org/files/acronym_glossary.pdf
http://www.semiconfareast.com/acronyms.htm
Electromagnetic Energy Spectrum
Last modified by Shawn Addington on 04/25/08