EE 413 Microelectronics
Table of Contents
Specific Course Topics
This course emphasizes microelectronic circuit design and fabrication, including thick film technology, thin film technology, multichip module technologies, surface mount technology, and printed circuit board technology. In the laboratory students will perform computer-aided design, photo-reduction, screen printing, component attachment, and printed circuit board construction, in the development of several microelectronic circuits.
Class/laboratory Schedule:
(2) 50 minute lectures and (1) two-hour laboratory each week
Prerequisite:
EE 356 - Electronics II
Textbook:
None
Course Objectives1:
1. Develop an understanding of various microelectronic circuit technologies [A]
2. Develop the skills necessary to design and fabricate microelectronic circuits in the
laboratory [A,B,C,D,E]
3. Develop a familiarity with the recent developments in microelectronics technologies
[A,B]
1
Letters in brackets correspond to departmental program objectivesThick film technology
Overview
CAD guidelines
Conductor, resistor, capacitor design
Alignment
Surface mount technology
Photolithography/screen stencil development
Printing
Conductor, resistor, dielectric pastes
Substrates
Settling/drying/firing
Component attachment
Thin film technology
Overview
Deposition techniques
Substrate materials
Conductor, resistor, dielectric materials
Conductor, resistor, capacitor design guidelines
Characterization of thin films
Multichip module (MCM) technology
Overview
MCM classifications (MCM-C, MCM-D, MCM-L)
MCM-C design and processing
MCM-D design and processing
MCM-L design and processing
"Recent Developments in Microelectronics" paper presentations
for Objective 1:
a. Students will demonstrate an
understanding of thick film microelectronic technology, including design guidelines and
process overview.
b. Students will demonstrate an understanding
of thin film microelectronic technology, including design, processing, and
characterization.
c. Students will demonstrate an understanding
of MCM technologies, including classifications, design, and processing.
for Objective 2:
a. Students will demonstrate an ability to
apply course concepts to the design of thick film microelectronic circuits.
b. Students will demonstrate an ability to use
laboratory equipment in the fabrication of thick film microelectronic circuits.
c. Students will demonstrate an ability to test
and evaluate thick film microelectronic circuits constructed in the laboratory.
d. Students will demonstrate an ability to
prepare technical reports.
for Objective 3:
a. Students will demonstrate an ability to
research recent developments in microelectronics technologies.
b. Students will demonstrate an ability to
prepare a formal written report on a recent development in microelectronics technologies.
c. Students will demonstrate an ability to
prepare a formal oral presentation on a recent development in microelectronics
technologies.
Contact Information:
Office : 507 Nichols Hall
Phone : 464-7343 (office)
464-3961 (home)
E-Mail : addingtonjs@vmi.edu
Office Hours:
Monday : 0900-1100
Tuesday/Thursday : 0900-1100, 1300-1400
Friday : 0900-1100
(and by appointment)
Lecture Policies:
Homework - Design layouts to be realized in the laboratory
Midterm - Take-home portion and in-class portion
Paper/Presentation - Topic: "Recent Developments in Microelectronics"
Final - Comprehensive
No make-up tests will be given.
Late homework will be graded accordingly.
Lecture Grading Policy |
Laboratory Grading Policy |
| Homework = 25% | Lab Reports = 60% |
| Midterm = 25% | Project Proposal = 10% |
| Paper/Presentation = 20% | Project Report = 30% |
| Final = 30% | |
| Lecture Grade = 100% | Laboratory Grade = 100% |
Overall Course Grade |
| Lecture Grade = 2/3 |
| Laboratory Grade = 1/3 |
| Overall Grade = 3/3 |
(1)
"Cadets' Responsibilities"
"Work for grade" is defined as any work
presented to an instructor for a formal grade or undertaken
in satisfaction of a requirement for successful completion of a course or degree
requirement. All work submitted for grade is considered the cadet's own
work. "Cadet's own work"
means that he or she has composed the work from his or her general accumulation
of knowledge and skill except as clearly and fully documented and that it has
been composed especially for the current assignment. No work previously submitted in any course at VMI or
elsewhere will be resubmitted or reformatted for submission in a current course
without the specific approval of the instructor.
In all work for grade, failure to distinguish between the cadet’s own work and
ideas and the work and ideas of others is known as plagiarism.
Proper documentation clearly and fully identifies the sources of all
borrowed ideas, quotations, or other assistance. The
cadet is referred to the VMI-authorized handbook for rules concerning
quotations, paraphrases, and documentation.
In all written work for grade, the cadet must include the words "HELP
RECEIVED" conspicuously on the document, and he or she must then do one
of two things: (1) state
“none,” meaning that no help was received except as documented in the work;
or (2) explain in detail the nature of the help received.
In oral work for grade, the cadet must make the same declaration before
beginning the presentation. Admission
of help received may result in a lower grade but will not result in prosecution
for an honor violation.
Each cadet bears the responsibility for familiarizing himself or herself
thoroughly with the policies stated in this section, with any supplementary
statement regarding work for grade expressed by the academic department in which
he or she is taking a course, and with any special conditions provided in
writing by the professor for a given assignment.
If there is any doubt or uncertainty about the correct interpretation of
a policy, the cadet should consult the instructor of the course. There
should be no confusion, however, on the basic principle that it is never
acceptable to submit someone else’s work, written or otherwise, formally
graded or not, as one’s own.
The violation by a cadet of any of these
policies will, if he or she is found guilty by the Honor Court, result in his or
her being dismissed from VMI. Neither
ignorance nor professed confusion about the correct interpretation of these
policies is an excuse.
(3)
Faculty Policies
(a)
Peer Collaboration:
Peer collaboration is not permitted for this course.
All homeworks and the
paper/presentation are
certified as your own, independent work. You
may not receive assistance from any sources other than your instructor and any sources authorized by your
instructor. You may discuss general course
concepts with each other; however, you may not discuss specific assigned problems.
All lab work is certified as the
work of the lab group only. You may not
receive assistance from any sources other than your instructor and any sources authorized
by your instructor. You may discuss general
lab concepts and procedures with each other; however, you may not share lab data.
All tests and exams are certified
as your own, independent work.
(b)
References:
Students must properly reference
direct quotations (with quotation marks and source), as well as significant paraphrasing
(with source).
Unless a direct quotation is
necessary, put the information in your own words to demonstrate your understanding of the
material.
See "Easy Access" for
more information regarding quotations and proper paraphrasing.
(c)
Other:
Use your lecture material to aid in the preparation of your lab reports.
All hand-drawn design layouts must be neatly drawn to scale on grid paper using a
straight-edge. Colored pencils are recommended.
Paper topic must be approved by the instructor.
| September 3 | Introduction (Overview, Safety) |
| September 10 | CAD Software |
| September 17 | Design #1 |
| September 24 | Photolithography #1 |
| October 1 | PDF Conductor #1 |
| October 8 | PDF Resistor1 #1 |
| October 15 | Measure Resistor1; PDF Resistor2 #1 |
| October 22 | Component Attachment (Lab Report #1 DUE) |
| October 29 | Lab #2 |
| November 5 | Lab #2 (continued) |
| November 12 | Lab #2 (continued) |
| November 19 | Project (Lab Report #2 DUE) |
| December 3 | Project |
| December 10 | Review; Project Report Due |
| I. Introduction : | What is the experiment about? |
| What are the objectives? | |
| II. Background/Preliminary Work : | Design guidelines and layouts (both hand-drawn and computer generated) |
| III. Experimental Work : | What are the experimental procedures? |
| Details on materials used, equipment setup and use, measurement and safety procedures | |
| IV. Results : | Summary of measurements (tables, graphs, etc., as appropriate) |
| V. Conclusions : | What do the results mean? |
| Were the objectives met? |
The
Microelectronics Foundation
IMAPS (International Microelectronics And
Packaging Society)Home Page
IEEE Components, Packaging, and Manufacturing Technology Society Home Page
DuPont Microcircuit Materials Web Site
SMT (Surface Mount Technology) Magazine Web Site
Advanced Packaging Magazine Web Site
Solid State Technology Magazine Web Site
Last modified by Shawn Addington on 08/20/07